Third Level Identification with Hyperspectral Imaging in Fingerprints

  • CPCI-S
作者: Delican, Vedat;Toreyin, Behcet Ugur;Cetin, Ege;Yalcin Saribey, Aylin
通讯作者: Delican, V
作者机构: Istanbul Tech Univ, Bilisim Enstitusu, Istanbul, Turkiye.
Istanbul Tech Univ, Lisansustu Egitim Enstitusu, Istanbul, Turkiye.
Uskudar Univ, Bagimlilik & Adli Bilimler Enstitusu, Istanbul, Turkiye.
通讯机构: Istanbul Tech Univ, Bilisim Enstitusu, Istanbul, Turkiye.
语种: 英文
关键词: Fingerprint,third level features,pore,poroscopy,identification
期刊: 2023 31ST SIGNAL PROCESSING AND COMMUNICATIONS APPLICATIONS CONFERENCE, SIU
ISSN: 2165-0608
年: 2023
会议名称: 31st IEEE Conference on Signal Processing and Communications Applications (SIU)
会议时间: JUL 05-08, 2023
会议地点: Istanbul Tech Univ, Ayazaga Campus, Istanbul, TURKEY
摘要: Fingerprints are accepted as the key evidence in reaching the crime and the criminal. Identification from fingerprints is done at three levels. At the first level; fingerprint groups and subgroups, at the second level; fingerprint line characteristics, and at the third level, details such as pores, papilla structure, width, mold area and fractures. With the developing technology, algorithms are developed in which fingerprint direction and angle, combinations of placement between papillary characteristics and papillary flows are included in the evaluation process. In the study, 1-n queries were made in a dataset created from 800 fingerprints by manually and automatically e...

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